Customizable 0.3mm Thin Diamond Saw Blade for DBC Substrate Semiconductor Wafer Cutting
Price varies depending on material, logo, quantity and customization requirements.
Introduction
| Inner Diameter Size | 40mm | thickness | 0.3mm |
| Face Width | 0.3mm | grit | Customizable, Fine Grit |
| application | Semiconductor, Electronic Components, Ceramic Cutting | hardness | High Hardness,Customizable |
| wheel type | Dicing Blade | shape | Circular Saw Blade |
| bonding agent | Metal | Abrasive Grade | High Quality |
| Number of segments | 1 | Construction type | Precision Cutting |
| width | 60mm | Abrasive Material | DBC Substrate, Ceramic, Silicon Wafer, Glass, PCB |
| Material | Metal Bond | customized support | OEM, ODM, Customized Size, Customized Grit |
| viscosity | N/A | size | 60*0.3*40mm |
| Bond Type | Metal Bond | Application Material | DBC/AMB Substrate, Ceramic, Silicon Wafer, Glass |
| Diamond Grit | 200#,Customizable |
We are a professional manufacturer and supplier, dedicated to maintaining consistent quality and establishing long-term partnerships with clients worldwide.
Our mission is to provide high-quality products and reliable service. We are committed to offering the following advantages:
- Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
- Strict quality control covering material selection, processing, surface finishing, and final packaging;
- Variety of products and specifications to meet diverse project requirements and application scenarios;
- OEM & customization support based on drawings, samples, or specific technical requirements;
- Flexible packaging solutions to ensure safe handling and transportation of products;
- Continuous improvement in products and services to better support customers in different markets.
If you are interested in our products, please feel free to contact us. We look forward to establishing long-term and mutually beneficial cooperation with you.