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Customizable 0.3mm Thin Diamond Saw Blade for DBC Substrate Semiconductor Wafer Cutting
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Inner Diameter Size 40mm thickness 0.3mm Face Width 0.3mm grit Customizable, Fine Grit application Semiconductor, Electronic Components, Ceramic Cutting hardness High Hardness,Customizable wheel type Dicing Blade shape Circular Saw Blade bonding agent Metal Abrasive Grade High Quality Number of segments 1 Construction type Precision Cutting width 60mm Abrasive Material DBC Substrate, Ceramic, Silicon Wafer, Glass, […]
Introduction
| Inner Diameter Size | 40mm | thickness | 0.3mm |
| Face Width | 0.3mm | grit | Customizable, Fine Grit |
| application | Semiconductor, Electronic Components, Ceramic Cutting | hardness | High Hardness,Customizable |
| wheel type | Dicing Blade | shape | Circular Saw Blade |
| bonding agent | Metal | Abrasive Grade | High Quality |
| Number of segments | 1 | Construction type | Precision Cutting |
| width | 60mm | Abrasive Material | DBC Substrate, Ceramic, Silicon Wafer, Glass, PCB |
| Material | Metal Bond | customized support | OEM, ODM, Customized Size, Customized Grit |
| viscosity | N/A | size | 60*0.3*40mm |
| Bond Type | Metal Bond | Application Material | DBC/AMB Substrate, Ceramic, Silicon Wafer, Glass |
| Diamond Grit | 200#,Customizable |
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