Customize Back Grinding Wheel for Grinding and Polishing Sapphire Wafer Silicon Wafer
Price varies depending on material, logo, quantity and customization requirements.
Introduction
| Inner Diameter Size | 55mm | thickness | 38mm |
| Face Width | 4.4mm | grit | 230/270#, 270/325# |
| application | Aluminum, Deburring, Ferrous Metals, nonferrous metals | hardness | K |
| wheel type | Angle Grinding Wheels, Cutt Off Wheels | shape | Cup-Shaped |
| bonding agent | Metal | Abrasive Grade | Very Fine |
| width | 305mm | Abrasive Material | Diamond |
| Material | Diamond | customized support | OEM, ODM, OBM |
| viscosity | 100% | application | Grinding and Polishing |
| Product name | Diamond Metal Grinding Wheel For Grinding and Polishing Sapphire | Bond | Metal Resin |
| MOQ | 1PCS | Diameter | 305mm |
| Abarasive material | Synthetic Diamond Abrasive | Package | Carton Package |
| Body Material | Alumium | Grit size | 230/270# |
We are a professional manufacturer and supplier, dedicated to maintaining consistent quality and establishing long-term partnerships with clients worldwide.
Our mission is to provide high-quality products and reliable service. We are committed to offering the following advantages:
- Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
- Strict quality control covering material selection, processing, surface finishing, and final packaging;
- Variety of products and specifications to meet diverse project requirements and application scenarios;
- OEM & customization support based on drawings, samples, or specific technical requirements;
- Flexible packaging solutions to ensure safe handling and transportation of products;
- Continuous improvement in products and services to better support customers in different markets.
If you are interested in our products, please feel free to contact us. We look forward to establishing long-term and mutually beneficial cooperation with you.