Customize Back Grinding Wheel for Grinding and Polishing Sapphire Wafer Silicon Wafer

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Customize Back Grinding Wheel for Grinding and Polishing Sapphire Wafer Silicon Wafer


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Inner Diameter Size 55mm thickness 38mm Face Width 4.4mm grit 230/270#, 270/325# application Aluminum, Deburring, Ferrous Metals, nonferrous metals hardness K wheel type Angle Grinding Wheels, Cutt Off Wheels shape Cup-Shaped bonding agent Metal Abrasive Grade Very Fine width 305mm Abrasive Material Diamond Material Diamond customized support OEM, ODM, OBM viscosity 100% application Grinding and […]


Inner Diameter Size55mmthickness38mm
Face Width4.4mmgrit230/270#, 270/325#
applicationAluminum, Deburring, Ferrous Metals, nonferrous metalshardnessK
wheel typeAngle Grinding Wheels, Cutt Off WheelsshapeCup-Shaped
bonding agentMetalAbrasive GradeVery Fine
width305mmAbrasive MaterialDiamond
MaterialDiamondcustomized supportOEM, ODM, OBM
viscosity100%applicationGrinding and Polishing
Product nameDiamond Metal Grinding Wheel For Grinding and Polishing SapphireBondMetal Resin
MOQ1PCSDiameter305mm
Abarasive materialSynthetic Diamond AbrasivePackageCarton Package
Body MaterialAlumiumGrit size230/270#


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