Sapphire Wafer Diamond Back Grinding Wheels for Thinning and Fine Grinding with Vitrified Bond

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Sapphire Wafer Diamond Back Grinding Wheels for Thinning and Fine Grinding with Vitrified Bond


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thickness T50mm grit 100/120, 150, 220, 600# 800# application Aluminum, Deburring, Ferrous Metals, nonferrous metals wheel type Angle Grinding Wheels, Flared Cup Grinding Wheels shape Flat-Shaped bonding agent Ceramic width W7mm customized support OEM, 2 size D265*T50*H28*W7*X10 Product name Diamond Vitrified Grinding-wheels Material Diamond Abrasive MOQ 1PCS Usage Grinding sapphire wafer Advantage High Working Efficiency […]


thicknessT50mmgrit100/120, 150, 220, 600# 800#
applicationAluminum, Deburring, Ferrous Metals, nonferrous metalswheel typeAngle Grinding Wheels, Flared Cup Grinding Wheels
shapeFlat-Shapedbonding agentCeramic
widthW7mmcustomized supportOEM, 2
sizeD265*T50*H28*W7*X10Product nameDiamond Vitrified Grinding-wheels
MaterialDiamond AbrasiveMOQ1PCS
UsageGrinding sapphire waferAdvantageHigh Working Efficiency
FeatureHigh QuallityPackingCarton Box
Work pieceLED Substrate, Silicon Wafer, Sapphire WaferApplicable machineCNC Grinder
FunctionAbrasive Grinding Profiling


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